GlenMorangie said:
Here's a question for you:
An electronic device generates 600 mW of internal heat, which is to be dissipated to the ambient air at 25 deg C through an aluminium heat sink with a total surface area of 12 cm2. The contact thermal resistance between the heat sink and the device is 50 K/W. The convection heat transfer coefficient between the heat sink and the air is 20 W/m2.K. The maximum permissible operating temperature of the device is 70 deg C. Show that the electronic device is destined to fail if operated under these conditions.
1st one to do it gets to sit my thermal engineering processes exam.
Heat transfer sucks eh! Wait til you get onto radiation, its almost impossible to get a correct answer.
But that has me stumped too. What is that 50 K/W?
Conduction Heat transfered =Convection Heat transfered=600mW